K. L. Tsou, K. Y. Chen, Y. D. Chou, Y. T. Cheng*, H. E. Tsai, and C. K. Lee (2022, Jun). Inkjet-printed flexible non-enzymatic lactate sensor with high sensitivity and low interference using a stacked NiOx/NiOx-Nafion nanocomposite electrode with clinical blood test verification. Talanta, 123598.
Yu-Tsan Lin, Liang-Kai Wang, Yu-Ting Cheng, Chih-Kuo Lee, and Hsiao-En Tsai, (2021, Jun). Molecularly Imprinted Polymer/Anodic Aluminum Oxide Nanocomposite Sensing Electrode for Low Concentration Troponin T Detection for Patient Monitoring Applications. ACS Sensors, 6, 2429-2435.
Y. W. Lin, K. L. Tsou, C. D. Fay, X. Liu, J. H. Y. Chung, D. Sharma, A. Jeiranikhameneh, P. H. Kuo, C. K. Tzeng, G. G. Wallace, C. Y. Wu, M. D. Ker, J. I. Chao, and Y. T. Cheng (2020, Dec). A microvalve cell printing technique using riboflavin photosensitizer for selective cell patterning onto a retinal chip. Bioprinting.
2. P. –S. Chen, Y. T. Lin, Y. T. Cheng, C.-K. Lee, and H. –E. Tsai (2020, Aug). Characterization and clinical serum test of a molecular imprinted polymer (MIP)- based cardiac troponin T sensing electrode for patient monitoring applications. Journal of Microelectromechanical Systems.
Yu-Min Fu, Meng-Chuin Chou, Che-Hao Kang, Yu-Ting Cheng, Pu-Wei Wu, Guan-Yu Chen, Ethan B Secor, Mark C Hersam (2020, Apr). An Inkjet Printing Technique for Scalable Microfabrication of Graphene-Based Sensor Components. IEEE Access.
Y.-S. Huang, K.-Y. Chen, Y. T. Cheng, C.-K. Lee, H.-E. Tsai (2020, Feb). An Inkjet-Printed Flexible Non-Enzymatic Lactate Sensor for Clinical Blood Plasma Test. IEEE Electron Device Letters .
Y. C. Hsieh, H. Y. Wang, K. C. Tso, C. K. Chang, C. S. Chen, Y. T. Cheng, and P. W. Wu (2019, Sep). Development of IrO2 Bio-ink for Ink-jet Printing Application. Ceramics International.
Yi-Chieh Hsieh, Han-Yi Wang, Kuang-Chih Tso, Chung-Kai Chang, Chi-Shih Chen, Yu-Ting Cheng, Pu-Wei Wu (2019, Sep). Development of IrO2 bio-ink for ink-jet printing application. Ceramics International.
Han-Yi Wang, Yi-Chieh Hsieh, Kuang-Chih Tso, Chung-Kai Chang, Yu-Ting Cheng, Pu-Wei Wu, Jyh-Fu Lee (2019, Jul). Combination of electrophoresis and electro-flocculation for the formation of adhering IrO2 pH sensing films. Electrochimica Acta.
Jia Wei Yang, Ming Liang Tseng, Yu Min Fu, Che Hao Kang, Yu Ting Cheng, ‐ ‐ ‐ ‐ ‐ Po Han Kuo, Chi Kuan Tzeng, Shih Hwa Chiou, Chung Yu Wu, and Guan Yu ‐ ‐ ‐ ‐ ‐ Chen (2018, Jul). Printable Graphene Oxide Micropatterns for a Bio Subretinal ‐ Chip. Advanced Healthcare Materials.
Yu-Min Fu, Jia-Chyi Pan, Kun-Lin Tsou, Yu-Ting Cheng (2018, Jun). A Flexible WO3-Based pH Sensor Array for 2-D pH Monitoring Using CPLoP Technique. IEEE Electron Device Letters.
P. R. Wu, T. Y. Chao, Y. T. Cheng (2015, Nov). Stacked Pulse-electroplated CoNiMnP-AAO Nanocomposite Permanent Magnets for MEMS. Journal of Micromechanics and Microengineering.
Chen-Hsuan Lin, Yu-Ting Cheng, Yung-Chang Chen, Yu-Min Fu, Wei-Hung Hsu (2015, Oct). The Methodology in The Accuracy Improvement of the Flexible Current Sensing Coil Tag for Household Two-Wire Power Lines. IEEE Sensors Journal.
Y. M. F, Y. R. Liang, Y. T. Cheng, P. W. Wu (2015, Apr). A Combined Process of Liftoff and Printing for the fabrication of Scalable Inkjet printed Microstructures on a Flexible Substrate. IEEE TRANSACTIONS ON ELECTRON DEVICES.
Chun-Hsing Li, Tzu-Yuan Chao, Chih-Wei Lai, Wei-Cheng Chen, Chun-Lin Ko, Chien-Nan Kuo, Yu-Ting Cheng, Ming-Ching Kuo, Da-Chiang Chang (2015, Feb). A 37.5-mW 8-dBm-EIRP 15.5-HPBW 338-GHz Terahertz Transmitter Using SoP Heterogeneous System Integration. IEEE Transactions on Microwave Theory and Techniques.
Yung-Chang Chen, Wei-Hung Hsu, Shih-Hsien Cheng, Yu-Ting Cheng (2014, Apr). A Power Sensor Tag With Interference Reduction for Electricity Monitoring of Weo-Wire Household Appliances. IEEE Transactions on Industrial Electronics.
【2012】
Yi-Chia Lee, Yu-Ting Cheng, and Wensyang Hsu, “Stress Gradient Modification of the Electroplated Ni-Diamond Nanocomposite for MEMS Fabrication,” J. Electrochem. Soc., Vol. 159, pp. H460-466, 2012.
Chien-Chang Chen and Yu-Ting Cheng, “Physical Analysis of a Biomimetic Microphone Witha Central-Supported (C-S) Circular Diaphragm for Sound Source Localization,” IEEE Sens. J., Vol. 12, pp. 1504-1512, 2012.
Yi-Chia Lee, Ming-Huang Li, Y. T. Cheng, Wensyang Hsu, and Sheng-Shian Li, “Electroplated Ni-CNT Nanocomposite for Micromechanical Resonator Applications,” IEEE Electron Dev. Lett., Vol. 33, pp. 872-874, 2012.
Chao-Lung Wang, Huang-Chung Cheng, I-Che Lee, Chun-Yu Wu, Yu-Ting Cheng, and Po-Yu Yang, “High-Performance Excimer-Laser-Crystallized Polycrystalline Silicon Thin-Film Transistors with the Pre-Patterned Recessed Channel,” Jpn. J. Appl. Phys., Vol. 51, pp. 066502(4pp), 2012.
Shih-Kang Fan, Yan-Ting Shen, Ling-Pin Tsai, Cheng-Che Hsu, Fu-Hsiang Ko, and Yu-Ting Cheng, “Atmospheric-Pressure Microplasma in Dielectrophoresis-Driven Bubbles for Optical Emission Spectroscopy,” Lab Chip, Vol. 12, pp. 3694-3699, 2012.
Chao-Lung Wang, Huang-Chung Cheng, Chun-Yu Wu, I-Che Lee, Yu-Ting Cheng, Po-Yu Yang, Chih-Hung Tsai, Chun-Hsiang Fang, and Chung-Chun Lee, “The Recovery Mechanism of the Light-Induced Instability of the Amorphous InGaZnO Thin Film Transistors,” Appl. Phys. Lett., Vol. 100, 212112(4pp), 2012.
Yung-Chang Chen, Sung-Chu Yu, Shih-Hsien Cheng, and Yu-Ting Cheng, “A Flexible Inductive Coil Tag for Household Two-Wire Current Sensing Applications,” IEEE Sens. J., Vol. 12, pp. 2129-2134, 2012.
【2011】
Chih-Peng Lin, Chieh-Hsiang Chang, and Y. T. Cheng, “Development of a Flexible SU-8/PDMS-Based Antenna,” IEEE Antenn. Wirel. Pr., Vol. 10, pp. 1108-1111, 2011.
Tzu-Yuan Chao, Chia-Wei Liang, Y. T. Cheng, and Chien-Nan Kuo, “Heterogeneous Chip Integration Process for Flexible Wireless Microsystem Application,” IEEE Trans. Electron Dev., Vol. 58, pp. 906-909, 2011.
Chun-Han Lai, Yu-Lin Yang, Li-Yin Chen, Yi-Jui Huang, Jing-Yu Chen, Pu-Wei Wu, Yu-Ting Cheng, and Yang-Tung Huang, “Effect of Crystallinity on the Optical Reflectance of Cylindrical Colloidal Crystals,” J. Electrochem. Soc., Vol. 158, pp. 37-40, 2011.
Tzu-Yuan Chao, M. C. Hsu, C. D. Lin, and Y. T. Cheng, “SU-8 Serial MEMS Switch for Flexible RF Applications,” J. Micromech. Microeng., Vol. 21, pp. 025010(6pp), 2011.
【2010】
Y. C. Chen, C. C. Chen, W. Tu, Y. T. Cheng, and F. G. Tseng, “Design and Fabrication of a Microplatform for the Proximity Effect Study of Localized ELF-EMF on the Growth of In Vitro HeLa and PC-12 Cells,” J. Micromech. Microeng., Vol. 20, pp. 125023(10pp), 2010.
C. C. Chen, Y. C. Chen, C. T. Chen, H. L. Hsiao, C. C. Chang, Y. T. Cheng, and M. L. Wu, “Thermal Analysis: VCSELs on an SiOB,” IEEE J. Sel. Top. Quant. Electron., Vol. 17, pp. 531-539, 2010.
C. Y. Yang, Y. T. Cheng, and W. Hsu, “The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application,” IEEE Trans. Adv. Packag., Vol. 33, pp. 356-361, 2010.
T. Y. Chao, C. H. Li, Y. C. Chen, H. Y. Chen, Y. T. Cheng, and C. N. Kuo, “An Interconnecting Technology for RF MEMS Heterogeneous Chip Integration,” IEEE Trans. Electron Dev., Vol. 57, pp. 928-938, 2010.
【2009】
Chien-Min Liu, Yuan-Chieh Tseng, Chih Chen, Ming-Chieh Hsu, Tzu-Yzan Chao, and Yu-Ting Cheng, “Superparamagnetic and Ferromagnetic Ni Nanorod Arrays Fabricated on Si Substrates Using Electroless Deposition,” Nanotechnology, Vol. 20, 415703(7pp), 2009.
C. C. Chen, Lun-Hao Hsu, Kai Rern, Y. T. Cheng, Yi-Fan Hsieh, and Pu-Wei Wu, “Gravity-Assisted Seeding Control for 1-D Material Growth,” IEEE Trans. Nanotech., Vol. 8, pp. 427-430, 2009.
M. Hsu, T. Y. Chao, Y. T. Cheng, C. Liu, and C. Chen, “The Inductance Enhancement Study of Spiral Inductor Using Ni-AAO Nanocomposite Core,” IEEE Trans. Nanotech., Vol. 8, pp. 281-285, 2009.
Chia-Sheng Huang, Junwei Chung, Yu-Ting Cheng, Wensyang Hsu, “Investigation of Ni-Based Thermal Bimaterial Structure for Sensor and Actuator Applicaiton,” Sensor Actuat. A-Phy., Vol. 149, pp. 298-304, 2009.
【2008】
Jingkuang Chen, Xiaoyang Cheng, Chien-Chang Chen, Pai-Chi Li, Jian-Hung Liu, and Y. T. Cheng, “A Capacitive Micromachined Ultrasonic Transducer Array for Minimally Invasive Medical Diagnosis,” J. Microelectromech. Syst., Vol. 17, pp. 599-610, 2008.
C. C. Chen, Ssu-Ying Chen, and Y. T. Cheng, “A Patterned Dielectric Support Process for High Performance Passive Fabrication,” IEEE Microw. Wirel. Compon. Lett., Vol.18, pp. 82-84, 2008.
【2007】
C. T. Kou, T. Y. Chao, I. Ta Chiang, and Y. T. Cheng, “Wafer Level Fabrication of Hermetically Sealed Microcavity with Robust Metal Interconnects for Chip Cooling Applications,” Sens. Actuat. A-Phy.., Vol. 139, pp. 259-264, 2007.
Yu-Wen Huang, Tzu-Yuan Chao, C. C. Chen, and Y. T. Cheng, “Power Consumption Reduction Scheme of Magnetic Microactuation Using Electroplated Cu-Ni Nanocomposite,” Appl. Phys. Lett., Vol. 90, pp. 244105(3pp), 2007.
C. M. Yeh, M. Y. Chen, J.-Y Gan, J. Hwang, C. D. Lin, T. Y. Chao, and Y. T. Cheng, “Gravity-Assisted Chemical Vapor Deposition of Vertically Aligned Single-walled Carbon Nanotubes - Effects of Temperature and CH4/H2 Ratio,” J. Electrochem. Soc., Vol. 154, pp. K15-K17, 2007.
C. M. Yeh, M. Y. Chen, J.-Y Gan, J. Hwang, C. D. Lin, T. Y. Chao, and Y. T. Cheng, “Effects of Time on the Quality of Vertically Oriented Single-Walled Carbon Nanotubes by Gravity-Assisted Chemical Vapour Deposition,” Nanotechnology, Vol. 18, pp. 145613(3pp), 2007.
【2006】
C. C. Chen, Cheng-De Lin, and Y. T. Cheng, “Model to Determine the Self-Resonant Frequency of Micromachined Spiral Inductors,” Appl. Phys. Lett., Vol. 89, no. 10, pp. 103521-103523, 2006.
Tzu-Yuan Chao, Guang-Ren Shen, and Y. T. Cheng, “Comparative Study of Ni-P-Diamonds and Ni-P-CNTs Nanocomposite Films,” J. Electrochem. Soc., Vol. 153, G98-G104, 2006.
Li-Nuan Tsai, Guang-Ren Shen, Y. T. Cheng, and Wensyang Hsu, “Performance Improvement of an Electrothermal Microactuator Using Ni-Diamond Nanocomposite,” J. Microelectromech. Syst., Vol. 15, pp. 149-159, 2006.
Zhi-Hao Liang, Y. T. Cheng, W. Hsu, and Yuh-Wen Lee, “A Wafer-Level Hermetic Encapsulation for MEMS Manufacture Application,” IEEE Trans. Adv. Pack.,Vol. 29, 513-519, 2006.
Li-Nuan Tsai, Yu-Ting Cheng, Wensyang Hsu, and Weileun Fang, “Ni-carbon Nanotubes Nanocomposite for Robust Microelectromechanical Systems Fabrication,” J. Vac. Sci. Tech. B., Vol. 24, pp. 205-210, 2006.
【2005 以前】
C. C. Chen, J. K. Huang, and Y. T. Cheng, “A Closed-Form Integral Model of the Spiral Inductor Using Kramers Kronig Relations,” IEEE Microw. Wirel. Compon. Lett., Vol. 15, pp.778-780, 2005.
Guang-Ren Shen, Y. T. Cheng, and Li-Nuan Tsai, “Synthesis and Characterization of Ni-P-CNT’s Nanocomposite Film for MEMS Applications,” IEEE Trans. on Nanotech., Vol. 4, pp. 539-547, 2005.
J. W. Lin, C. C. Chen, and Y.-T. Cheng, “A Robust High Q Micromachined RF Inductor for RFIC Applications,” IEEE Trans. Electron Devices, Vol. 52, pp. 1489- 1496, 2005.
Kwok-Siong Teh, Yu-Ting Cheng, and Liwei Lin, “MEMS Fabrication Based on Nickel-Nanocomposite: Film Deposition and Characterization,” J. Micromech. Microeng., Vol. 15, pp. 2205-2215, 2005.
Y. T. Cheng, W.T. Hsu, K. Najafi, C. T. Nguyen and Liwei Lin, “Vacuum Packaging Technology Using Localized Aluminum/Silicon-to Glass Bonding,” J. Microelectromech. Syst., Vol. 11, pp. 556-565, 2002.
Y. T. Cheng, Liwei Lin, and Khalil Najafi, “Fabrication and Hermeticity Testing of A Glass-Silicon Packaging Formed Using Localized Aluminum/Silicon-to-Glass Bonding,” J. Microelectromech. Syst., Vol. 10, pp. 392~399, Sep., 2001.
Y. T. Cheng, Liwei Lin, and Khalil Najafi, “Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging,” J. Microelectromech. Syst., Vol. 9, pp. 3-8, March 2000.
Liwei Lin, Y. T. Cheng, and K. Najafi, “Formation of Silicon-Gold Eutectic Bond Using Localized Heating Method,” Jpn. J. Appl. Phys., Vol. 37, no. 11B, pp. L1412-L1414, Nov. 1998.
Liwei Lin, Y. T. Cheng, and C.-J. Chiu, “Comparative Study of Hot Embossed Microstructures Fabricated by Laboratory and Commercial Environments,” Microsystem Technologies, Vol. 4, No. 3, pp. 113-116, 1998.
Y. T. Cheng, S. J. Lin, and J. Hwang, “The Effect of Diamond Facet on the Electrical Properties of Pt/BF2+ Ion Implanted Polycrystalline Diamond,” Appl. Phys. Lett., Vol. 63, pp. 3344-3346, 1993.
【Conference Paper】
Ching-Jen Lee, Pin-Cheng Tseng, Wei-Chian Wang, Yun-Hao Liou, Yu-Ting Cheng, Chien-Nan Kuo（2023年05月）。Design and Fabrication of A Sub-THz Co-reflectively Curved Patch-reflector Antenna Array for Gain Enhancement and Near Field Focusing。73rd IEEE ECTC ，Orlando, USA。
Y. S. Tang, T. L. Yang, Y. T. Cheng*, H. -E. Tsai, and Y. S. Chen, (2023, Jan). Real-time Dynamic Lactate Detection in a Pipeline Using a Microsensing Needle for ICU Patient Monitoring Application. IEEE MEMS 2023, Munich, Germany.
Y. D. Tsou, Y. T. Cheng, H. E. Tsai, and Y. S. Chen (2022, Aug). Flexible inkjet printed hydrogen sulfide sensing electrodes. ACS Fall Meeting , Chicago .
L. K. Wang, C. H. Lin, Y. T. Cheng*, H. E. Tsai and C. K. Lee (2022, Jun). A Molecular Imprinted Polymer (MIP)-based NT-proBNP Sensing Electrode Using LG9 Peptides for Heart Failure Monitoring. Hilton Head Workshop 2022, A Solid-State Sensors, Actuators and Microsystems Workshop., USA.
Che-Hao Kang, Yu-Min Fu, Chin-Chuan Kao, Jia-Wei Yang, Ming-Liang Tseng, Zih-Yu Yu, Yu-Ting Cheng, Guan-Yu Chen, Pu-Wei Wu, Chung-Yu Wu (2019, Jun). A Combined Process Of Silicon Shadow Masking And Inkjet Printing (SSMP) For Making Graphene Oxide And Reduced Graphene Oxide Microstructures For Selective Cell Culturing Applications. 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII).
Chih-Chung Chen, Yu-Min Fu, Hsin-Feng Hsu, Yu-Ting Cheng (2019, Jun). An Alignment Scheme for Low Cost and High Precision Siob Fabrication Using an Electromagnetic Microactuator with 5 Dof. 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII).
Jia-Han Yang, Kun-Lin Tsou, Yu-Min Fu, Yu-Ting Cheng (2019, Jun). Process Development of Low Resistive Ag-Based Through Silicon Vias Usig Inkjet Printing Technique for 3D Microsystem Integration. IEEE Int. Conf. on MEMS.
KJ Chen, WM Chen, LY Tang, YT Cheng, MD Ker, CY Wu (2019, Jun). A 13.56 MHz Metamaterial for the Wireless Power Transmission Enhancement in Implantable Biomedical Devices. 2019 20th International Conference on SolidState Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII).
E. C. Liang, K. L. Tsou, Y. S. Huang, Y. T. Cheng, S. H. Chen, Y. S. Chen, M. D. Chou, P. W. Wu, and L. H. Lu (2018, Nov). A pH and Temperature Sensing Needle for Muscle Tissue Ischemia Monitoring. MicroTAS 2018.
K. L. Tsou, Y. M. Fu, E. C. Liang, and Y. T. Cheng (2018, Nov). Flexible InkjetPrinted Multi-Ionic Sensor Tape for Biomedical Applications. MicroTAS 2018.
M. T. Hsu, T. Y. Chiu, S. Y. Wu, Y. T. Cheng, C. N. Kuo, and C. H. Li (2018, Jan). A Silicon-Based Parabolic Sub-THz Reflector Antenna for Gain Enhancement and Near-Field Focus Application. IEEE Int. Conf. on MEMS.
P. R. Jadhav, Y. T. Cheng, S. K. Fan and C. Y. Liang (2018, Jan). A Sub-mW Electromagnetic Microspeaker with Bass Enhancement Using A Parylene/Graphene/Parylene Composite Membrane. IEEE Int. Conf. on MEMS.
Y. T. Cheng and Y. S. Chen (2017, Dec). A Micromachined Multimodal Probe for Heart Muscle Monitoring. Invited Talk, International Conference on Biosensors, Bioelectronics, Biomedical Device, BioMEMS/NEMS & Applications, Bio4App 2017.
Jyun-How Chen, Yu-Min Fu and Y. T. Cheng (2017, Jun). The performance enhancement scheme of on-chip spiral inductors using metal-oxide based AAO nanocomposite. IEEE Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).
Yi-Xuan Lu, Meng-Tse Hsu, Y. T. Cheng, Chun-Hsing Li, and Chien-Nan Kuo (2017, Jun). Focused source formation using a micro disc-like patch antenna array for THz CMOS transceiver applications. IEEE Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).
Tsung-Han Yang, Zi-Li Guo1, Yu-Min Fu, Yu-Ting Cheng, Yen-Fang Song, and Pu-Wei Wu (2017, Jan). A Low Temperature Inkjet Printing and Filling Process for Low Resistive Silver TSV Fabrication in a SU-8 substrate. IEEE Int. Conf. on MEMS, Las Vegas.
Yu-Min Fu, Meng-Chuin Chou, Yu-Ting Cheng, Ethan B. Secor, and Mark C. Hersam (2017, Jan). An Inkjet Printed Piezoresistive Back-to-Back Graphene Tactile Sensor for Endosurgical Palpation pplications. IEEE Int. Conf. on MEMS, Las Vegas, USA.
Y. T. Cheng and Y. S. Chen (2017, Dec). A Micromachined Multimodal Probe for Heart Muscle Monitoring. Invited Talk, International Conference on Biosensors, Bioelectronics, Biomedical Device, BioMEMS/NEMS & Applications, Bio4App 2017.
Jyun-How Chen, Yu-Min Fu and Y. T. Cheng (2017, Jun). The performance enhancement scheme of on-chip spiral inductors using metal-oxide based AAO nanocomposite. IEEE Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).
Yi-Xuan Lu, Meng-Tse Hsu, Y. T. Cheng, Chun-Hsing Li, and Chien-Nan Kuo (2017, Jun). Focused source formation using a micro disc-like patch antenna array for THz CMOS transceiver applications. IEEE Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).
Tsung-Han Yang, Zi-Li Guo1, Yu-Min Fu, Yu-Ting Cheng, Yen-Fang Song, and Pu-Wei Wu (2017, Jan). A Low Temperature Inkjet Printing and Filling Process for Low Resistive Silver TSV Fabrication in a SU-8 substrate. IEEE Int. Conf. on MEMS, Las Vegas.
Yu-Min Fu, Meng-Chuin Chou, Yu-Ting Cheng, Ethan B. Secor, and Mark C. Hersam (2017, Jan). An Inkjet Printed Piezoresistive Back-to-Back Graphene Tactile Sensor for Endosurgical Palpation pplications. IEEE Int. Conf. on MEMS, Las Vegas, USA.
Y. D. Lee, J. C. Pan, Y. T. Cheng, Y.S. Chen (2016, Jun). A Hexagonal Multipoint PH and Temperature Sensing Needle for 3D Pig Heart Muscle PH Monitoring with Temperature Compensation. Solid-State Sensors, Actuators and Microsystems Workshop Hilton Head Island, Hilton Head Island, SC, USA.
Yu-Min Fu, Che-Yu Chen, Xin-Hong Qian, Yu-Ting Cheng, Chung-Yu Wu, JuiSheng Sun, Chien-Chun Huang, Chao-Kai Hu (2015, Aug). A Microfabricated Coil for Implantable Applications of Magnetic Spinal Cord Stimulation. IEEE Conf. Eng. in Med. and Bio. Soc. (EMBC), Milano, Italy.
Z. L. Guo, Y. M. Fu, Y. T. Cheng, B.Y. Shew, P. W. Wu (2015, Jun). Characteristic Improvement of Inkjet Printed Ag Interconnects Using Tape Onoff and Mirror-reaction Process. IEEE Physical and Failure Analysis of Integrated Circuits (IPFA), Hsinchu, Taiwan.
C. Weber, Y. C. Chen, Y. T. Cheng (2014, Dec). The Study of the Inductive Coil to the Acoustic Performance of Electromagnetic Driven Microspeaker. The XXVIII eurosensors, Procedia Engineering.
Yu-Min Fu, Yen-Ju Liang, Yu-Ting Cheng, Pu-Wei Wu (2014, Apr). Size scaling of Printed Microstructures using a Lift-off Printing(LoP) Process. IEEE Nano/Micro Engineered and Molecular Systems (NEMS), Waikiki Beach, HI.
Chun-Hsing Li, Jan-Jr Wu, Chien-Nan Kuo, Yu-Ting Cheng, and Ming-Ching Kuo (2013, Jun). A broadband interconnect for THz heterogeneous system integration. IEEE Int. Microwave Symp., Seattle, USA.
Y. C. Chen, W. H. Hsu, S. H. Cheng, and Y. T. Cheng (2013, Jun). Antielectromagnetic Interference and Calibration Schemes of Flexible Current Sensor Tag for Reliable Current Detection in Household Apppliance. IEEE Proceedings of the 16th International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers’13, Barcelona, Spain.
Y. T. Fan, Y. C. Chen, Y. T. Cheng and Y. S. Chen (2013, Jun). Design and Fabrication of a Multipoint pH and Temperature Recording Probe for Real-Ttime Heart Muscle Monitoring. IEEE Proceedings of the 16th International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers’13, , Barcelona, Spain.
Y. C. Chen, W. H. Hsu, S. H. Cheng and Y. T. Cheng (2012, Oct). Sensitivity Enhancement of the Flexible Inductive Coil Tag Using Magnetic C-Clamp Stripes for the Current Detection of Household Two-Wire Power Lines . IEEE Int. Conf. on Sensors .
【2012】
Yung-Chang Chen, Wei-Hung Hsu, Shih-Hsien Cheng, and Yu-Ting Cheng, “Sensitivity Enhancement of the Flexible Inductive Coil Tag Using Magnetic C-Clamp Stripes for the Current Detection of Household Two-Wire Power Lines,” in Proc. IEEE Sensors, Taipei, Taiwan, Oct. 28-31, pp. 2050-2053.
I. Ta Chiang, Guang-Ren Shen, and Y. T. Cheng, “Crystallization Effects on the Performance of Electrothermal Microactuator Made of Ni-P-Diamond Nanocomposite,” in Proc. IEEE APCOT, Nanjing, China, Jul. 8-11, 2012.
T. Y. Chao, J. R. Lin, and Y. T. Cheng, “CoNiMnP-AAO Hard Magnetic Nanocomposite Film for MEMS Applications,” in Proc. IEEE-NEMS, Kyoto, Japan, Mar. 5-8, 2012.
Y. C. Chen, C. W. Chu, T. Y. Chao, Y. T. Cheng, and C. Chen, “The Electromigration Investigation of Cu-Ni Nanocomposites,” in Proc. IEEE-NEMS, Kyoto, Japan, Mar. 5-8, 2012.
Y. C. Chen, W. H. Hsu, S. H. Cheng, and Y.T. Cheng, “A Flexible, Non-Intrusive Power Sensor Tag for the Electricity Monitoring of Two-Wire Household Appliances,” in Proc. IEEE MEMS , Paris, France, Jan. 29 - Feb. 2, 2012, pp. 620-623.
【2011】
C. J. Huang, C. S. Chen, K. A. Wen, Y. T. Cheng, J. Y. Chen, C. S. Chang, and W. C. Chou, “Standard 0.18um 1P6M CMOS IC Foundry Flow for Accelerometer, Analog Readout Circuit and Wafer Level Capping Package Integration,” in Proc. IEEE Sensors, Limerick, Ireland, Oct. 28-31, 2011, pp. 750-753.
Tzu-Yuan Chao, H. F. Hsu, K. M. Chen, and Y. T. Cheng, “NiFe-AAO Nanocomposite for Performance Enhancement of On-Chip Spiral Inductors,” in Proc. Transducers, Beijing, China, Jun. 5-9, 2011, pp. 2686-2689.
Kuei-Shu Li, Tzu-Yuan Chao, Y. T. Cheng, Jing-Kuang Chen, and Yih-Sharng Chen, “Temperature Sensing Probe Integrated with an SU-8 Flexible Ribbon Cable for Heart Surgery Application,” in Proc. Transducers, Beijing, China, Jun. 5-9, 2011, pp. 2180-2183.
Tzu-Yuan Chao and Y. T. Cheng, “SU-8 Flexible Ribbon Cable for Biomedical Microsystem Interconnection,” in Proc. IEEE IEEE-NEMS, Kaohsiung, Taiwan, Feb. 20-23, 2011, pp.622-625.
Y. C. Chen and Y. T. Cheng, “A Low-Power Milliwatt Electromagnetic Microspeaker Using A PDMS Membrane for Hearing Aids Application,” in Proc. IEEE MEMS, Cancun, Mexico, Jan. 23-27, 2011, pp. 1213-1216.
Yi-Chia Lee, Y. T. Cheng and Wensyang Hsu, “Electroplating Process of Ni-CNTS Nanocomposite for MEMS Resonator Fabrication,” in Proc. IEEE MEMS, Cancun, Mexico, Jan. 23-27, 2011, pp. 416-419.
Tzu-Yuan Chao and Y. T. Cheng, “Wafer-Level Chip Scale Flexible Wireless Microsystem Fabrication,” in Proc. IEEE MEMS, Cancun, Mexico, Jan. 23-27, 2011, pp. 344-347.
【2010】
Chung-Min Lai, Tzu-Yuan Chao, Wen-An Tsou, Mei-Fen Chou, Yu-Ting Cheng, and Kuei-Ann Wen, “A Polar Modulated Tri-band Power Amplifier Using Flexible Substrate Based MEMS Switches,” in Proc. EuMC, Paris, France, Sep. 28-30, 2010.
C. C. Chen, Y. C. Chen, K. Y. Lin, and Y. T. Cheng, “Hybrid Biomimetic Directional Microphone for the Full Space Sound Source Localization,” in Proc. Head Hilton Workshop, Hilton Head, South Carolina, USA, Jun. 6-10, 2010.
【2009】
C. C. Chen, C. Singh, Y. C. Chen, Hsu-Liang Hsiao, Chia-Yu Lee, Mount-Learn Wu, and Y. T. Cheng, “Equivalent Electrothermal Circuit Model for Vertical-Cavity Surface-Emitting Lasers on Silicon Optical Bench,” in Proc. THERMINIC, Leuven, Belgium, Oct. 7-9, 2009.
C. C. Chen, Lun-Hao Hsu, and Y. T. Cheng, “Formation, Rolling, and Agglomeration of a Co Seed Droplet in Patterned Inverted Silicon Nano-Pyramid,” in Proc. IEEE-NANO, Genoa, Italy, Jul. 26-30, 2009.
C. C. Chen, Y. C. Chen, Hsu-Liang Hsiao, Chia-Yu Lee, Mount-Learn Wu, and Y. T. Cheng, “Equivalent Electrothermal Circuit Model and Thermal Analysis for Vertical-Cavity Surface-Emitting Lasers on Silicon Optical Bench,” 第十三屆奈米工程暨微系統技術研討會 (NMC), 新竹, Jul. 9-10, 2009.
C. C. Chen, Y. C. Chen, Keng-Yu Lin, and Y. T. Cheng, “A Novel Design and Analytical Model for Biomimetic Microphone with Floating Center-Supported Gimbal Circular Diaphragm,” 第十三屆奈米工程暨微系統技術研討會 (NMC), 新竹, July 9-10, 2009.
C. S. Huang, Y. T. Cheng, C. J. Yeh, H. K. Liu, and W. Hsu, “Young's Modulus and Fatigque Lifetime Improvements by Diamond Size Effect on Electroplated Ni-Diamond Nanocomposite,” in Proc. Transducers, Denver, Colorado, USA, Jun. 21-25, 2009.
Y. C. Chen, Wei-Ting Liu, Tzu-Yuan Chao, and Y. T. Cheng, “An Optimized Cu-Ni Nanocomposite Coil for Low-power Electromagnetic Microspeaker Fabrication,” in Proc. Transducers, Denver, Colorado, USA, Jun. 21-25, 2009.
Y. C. Chen, C. C. Chen, W. T. Tu, Y. T. Cheng, and F. G. Tseng, “The Investigation of the Proximate Effect of Time-Variant Magnetic Field on the Growth of In-Vitro HeLa and PC-12 Cells Using On-Glass Spiral Inductor,” in Proc. MMB, Quebec, Canada, pp. 216-217, Apr. 1-3, 2009.
【2008】
Y. C. Chen, C. C. Chen, Wen Hao Ching, and Y. T. Cheng, “Design and Fabrication of High Performance Biomimetic Microphone Using Oxalis-like Sensing Diaphragm for Sound Localization,” in Proc. APCOT, Tainan, Taiwan, session 1B2-1, Jun. 22-25, 2008.
Yi-Chia Lee, Yu-Ting Cheng, and Wensyang Hsu, “Process Effect of Electroplated Ni and Ni-Diamond Nanocomposite Film on the Stress Distribution of Micromechanical Structure,” in Proc. APCOT, Tainan, Taiwan, Jun. 22-25, 2008.
【2007】
Yu Wen Huang, Tzu-Yuan Chao, and Y.T. Cheng, “Synthesis and Device Fabrication of Cu-Ni Nanocomposite for Low Power Magnetic Microactuation,” in Proc. IEEE-NANO, Hong Kong, China, pp. 899-902, Aug. 2-5, 2007.
Chun-Hsing Li, Chang Tsung Fu, Tzu-Yuan Chao, Chien-Nan Kuo, Y. T. Cheng, and D.-C. Chang, “Broadband Flip-Chip Interconnects for Millimeter-Wave Si-Carrier System-on-Package,” in Proc. IMS, Honolulu, Hawaii, pp.1645-1648, Jun. 3-8, 2007.
Chia-Sheng Huang, Junwei Chung, Yu-Ting Cheng, and Wensyang Hsu, “Thermal Bimetallic Microactuators by Ni and Ni-Diamond Nanocomposite,” in Proc. IEEE-NEMS, Bangkok, Thailand, Jan. 16-19, 2007.
【2006】
Xiaoyang Cheng, Jingkuang Chen, Tongsheng Cheng, and Wensyang Hsu, “An Implantable Ultrasonic Doppler Blood Flowmeter,” in Proc. IEEE Ultrasonics Sym., Vancouver, Canada, pp. 808-811, Oct. 3-6, 2006.
Y. C. Chen, C. H. Li, J. K. huang, C. N. Kuo, and Y. T. Cheng, “Low Power 3~8-GHz UWB Tunable LNA Design Using SiP Technology,” in Proc. ICECS, Nice, France, Dec. 10-13, 2006.
Tzu-Yuan Chao, and Y. T. Cheng, “Synthesis and Characterization of Cu/CoFe2O4 Magnetic Nanocomposite for RFIC Application,” in Proc. IEEE-NANO, Cincinnati, Ohio, pp. 810-813, Jul. 16-20, 2006.
C. T. Kou, T. Y. Chao, I. Ta Chiang, and Y. T. Cheng, “Wafer Level Fabrication of Hermetically Sealed Microcavity with Robust Metal Interconnects for Chip Cooling Applications,” in Proc. APCOT, Singapore, Jun. 25-28, 2006.
Yi-Chia Lee, Li-Nuan Tsai, Yu-Ting Cheng, and Wensyang Hsu, “Performance Enhancement of Comb Drive Actuator Utilizing Electroplated Nickel-Diamond Nanocomposite,” in Proc. APCOT, Singapore, Jun. 25-28, 2006.
Chia-Yeh Yang , Y. T. Cheng, and W. S. Hsu, “Nano-Roughening for Reliable N/MEMS Manufacture,” in Proc. IEEE-NEMS, Zhuhai, China, Jan. 18-21, 2006.
【2005 以前】
Li-Nuan Tsai, Y. T. Cheng, and Wensyang Hsu, “Nanocomposite Effects on The Coefficient of Thermal Expansion Modification for High Performance Electro-Thermal Microactuator,” in Proc. IEEE MEMS, Miami Beach, Florida, U.S.A., pp. 467-470, Jan. 30 - Feb. 3, 2005.
Guang-Ren Shen, Li-Nuan Tsai, Y. T. Cheng, and Wensyang Hsu, “Ni-P-CNT's Nanocomposite Film for MEMS Applications,” in Proc. IEEE-NANO, Munich, Germany, pp. 192-194, Aug. 16-19, 2004.
Jr-Wei Lin, C. C. Chen, J. K. Huang, and Y. T. Cheng, “An Optimum Design of The Micromachined RF Inductor,” in Proc. RFIC, Fort Worth, Texas, USA, pp. 639-642, Jun. 6-8, 2004.
Li-Nuan Tsai, Guang-Ren Shen, Yu-Ting Cheng, and Wensyang Hsu, “Power and Reliability Improvement of an Electro-Thermal Microactuator Using Ni-Diamond Nanocomposite,” in Proc. ECTC, Las Vegas, Nevada, USA, pp. 472-476, Jun. 1-4, 2004.
Zhi-Hao Liang, Yu-Ting Cheng, W. Hsu, and Yuh-Wen Lee, “A Low Temperature Wafer-Level Hermetic Package Using UV Curable Adhesive,” in Proc. ECTC, Las Vegas, Nevada, USA, pp. 1486-1491, Jun. 1-4, 2004.
K. S. Teh, Y. T. Cheng, and L. Lin, “Using Nickel Nanocomposite Films For the Fabrication of MEMS Microresonators,” in Proc. ICCM-14, San Diego, CA, USA, ID1446, Jul. 14-18, 2003.
K. S. Teh, Y. T. Cheng, and Liwei Lin, “Nickel Nano-Composite Film For MEMS Applications,” in Proc. Tranducers, Boston, MA, USA, Jun. 8-12, 2003.
K. S. Teh, Y. T. Cheng, and Carlos Sambucetti, “Selective Plating of Nickel Ceramic Composite Films for MEMS Applications,” in Proc. IEEE MEMS, Las Vegas, Nevada, USA, pp. 384-387, Jan. 20-24, 2002.
Y. T. Cheng, Carlos Sambucetti, and K. S. Teh, “Fabrication of Micropipes for Optical Interconnects Using Electroless Processes,” in Proc. IMECE, New York, USA, Nov. 11-16, 2001.
Y. T. Cheng, W. T. Hsu, Liwei Lin, C. T. Nguyen, and Khalil Najafi, “Vacuum Packaging Using Localized Aluminum/Silicon-to-Glass Bonding Using Localized Aluminum/Silicon-to-Glass Bonding,” in Proc. IEEE MEMS, Interlaken, Switzerland, pp. 18-21, Jan. 21-25, 2001.
Y. T. Cheng, Liwei Lin, and Khalil Najafi, “Fabrication and Hermeticity Testing of A Glass-Silicon Packaging Formed Using Localized Aluminum/Silicon-to-Glass Bonding,” in Proc. IEEE MEMS, Miyazaki Japan, pp. 757-762, Jan. 23-27, 2000.
G. He, Liwei Lin, and Y. T. Cheng, “Localized CVD Bonding for MEMS Packaging,” in Proc. Transducers, Sendai, Japan, pp. 1312-1315, Jun. 7-10, 1999.
Yu-Ting Cheng, Liwei Lin, and Khalil Najafi, “Localized Bonding with PSG or Indium Solder as Intermediate Layer,” in Proc. IEEE MEMS, Orlando, Florida, USA, pp. 285-289, Jan. 17-21, 1999.
Y. T. Cheng, Liwei Lin, and Khalil Najafi, “Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging,” in Proc. 1998 Solid-State Sensors and Actuators Workshop, Hilton Head, SC, USA, pp. 233-236, Jun. 7-11, 1998.
Y. T. Cheng, S. L. Lee, M. S. Hsu, K. C. Huang, and J. Hwang, “The Bonding Characteristics of BF2+ion Implanted Synthetic Diamond Films,” in Proc. Annual Conference of the Chinese Society for Materials Science, Taipei, Taiwan, pp.546-548, Apr. 24-26 ,1992.
【Book Chapter】
Y. T. Cheng and Liwei Lin. Soldering by Local Heating . Jul, 2021.
Y. C. Lee, Yu-Ting Cheng, Ramesh Ramadoss. MEMS Packaging, WSPC Series in Advanced Integration and Packaging: Vol. 5 (ISBN: 978-981-3229-35-8). 2018.
Yu-Chuan Su, JongBaeg Kim, Yu-Ting Cheng, Mu Chiao and Liwei Lin. Packaging and Reliability Issues in Micro/Nano Systems. Handbook or Nanotechnology, Springer-Verlag Berlin Heidelberg (ISBN: 978-3-662-54355- 9). 2017: 1505-1539.
Yi-Chiu, Yu-Ting Cheng. SU-8 for Microsystem Fabrication. Photocured Materials, Royal Society of Chemistry (ISBN: 978-1-78262-001-3). 2014: 220- 255.
JongBaeg Kim, Yu-Ting Cheng, Mu Chiao, and Liwei Lin, “Packaging and Reliability Issues in Micro/Nano Systems,” Handbook of Nanotechnology, 2nd edition Springer-Verlag Berlin Heidelberg, ISBN-10:3-540-29855-X, pp. 1777-1803, 2007.
Y.T. Cheng, and Liwei Lin, “MEMS Packaging and Thermal Issues in Reliability,” Handbook of Nanotechnology, Springer-Verlag Berlin Heidelberg, ISBN 3-540-01218-4, pp. 1111-1132, Jan. 2004.
Ph.D. Thesis, “Localized Heating and Bonding for MEMS Package,” 2000.
Master Thesis, “The Reliability of the Electrical Properties of Pt(Au)/Polycrystalline Diamond Contacts,” 1993.
【Patent】
Yu-Ting Cheng, S. A. Goma, J. H. Magerlein, S. Purushothama, C. J. Sambucetti, and G. F. Walker, “Technology for Fabrication of Packaging Interface Substrate Wafers with Fully Metallized Vias Through the Substrate Wafer,” US Patent, No. 788305 B2, Feb. 1, 2011.
Chien-Chang Chen, and Yu-Ting Cheng, “Method for Predicting Inductance and Self-Resonant Frequency of a Spiral Inductor,” US Patent, No. 7,451,415, Nov. 11, 2008.
Yu-Ting Cheng, S. R. Chiras, D. W. Henderson, S.-K. Kang, S. J. Kilpatrick, H. A. Nye,-III, C. J. Sambucetti, and D.-Y. Shih, “Ball Limiting Metallurgy, Interconnection Structure Including the Same, and Method of Forming an Interconnection Structure,” US Patent, No. 7,273,803, Sep. 25, 2007.
Chien-Chang Chen, and Yu-Ting Cheng, “一種預測雙埠晶片懸浮螺旋式電感之感值與共振頻率的方法,” Taiwan Patent, No. 200734927, Sep. 16, 2007.
Liwei Lin, Yu-Ting Cheng, Khalil Najafi and Kensall D. Wise, “Microstructures,” US Patent, No. 6,436,853 Aug. 20, 2002.
Liwei Lin, Yu-Ting Cheng, Khalil Najafi and Kensall D. Wise, “Process for Making Microstructures and Microstructures Made Thereby,” US Patent, No. 6,232,150, May 15, 2001.